Epson print chip....

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Ding Dang Doo
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Seiko Epson Corporation ("Epson") today announced that it has succeeded in leveraging its proprietary inkjet technology to develop what the company believes is the world's first ultra-thin 20-layer circuit board.

Multilayer circuit boards are normally produced by using a photolithography process to pattern a copper foil bonded to a base board. However, the industry has struggled to produce thin, lightweight, high-density multilayer circuit boards cheaply because the traditional process requires (1) thick copper layers; (2) the creation of a different photomask for each layer; (3) a complex step for forming through-holes to electrically connect different layers; and (4) a large volume of photoresist, developer, etchants, stripping agents and other chemicals.

http://www.epson.co.jp/e/newsroom/news_2004_11_01.htm
 

Llew

cerca trova...
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Bad news for circuit-tracing those difficult faults :(

Llew
 
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