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Virtual Radar Server - Trouble shooting!
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<blockquote data-quote="jeallen01" data-source="post: 1003152" data-attributes="member: 176704"><p>From what I can see/feel, the dongles are getting to surface temps of around 55C (and that was happening even before I added the line amp near the antenna, and the DC inserter to power it!) when not strapped to the SSA metal case, and around 30-35C when they are - to me that means that the internal temps are quite a bit higher, and probably some of those are very localised.</p><p>(FWIW, I did a lot of product safety testing before I retired, and that included extended temperature testing to ensure that products & critical components did not exceed safe limits for insulation and to be touched - so I kinda have a "calibrated finger" which knows when something gets near the safe-to-touch temps limits, such as around 60C for metal handles/cases!)</p><p>What is kinda puzzling is the way that the USB id/response changes after they have begun to "fail" and are then allowed to cool down - at which point they seem to fail completely. To me that means there is one or more of the following defects:</p><p>- one or more overheated electronic components failing, and it seems to be the RF ends that fail first, followed by the USB interfaces.</p><p>- soldered joints failing due to thermal stressing/cooling factors, which would be understandable if the joints (presumably most of the components are SMD) were not made correctly in the first place</p><p>- inadequate manufacturing process test & burn-in times to screen out dodgy units and identify the root causes of the problems</p></blockquote><p></p>
[QUOTE="jeallen01, post: 1003152, member: 176704"] From what I can see/feel, the dongles are getting to surface temps of around 55C (and that was happening even before I added the line amp near the antenna, and the DC inserter to power it!) when not strapped to the SSA metal case, and around 30-35C when they are - to me that means that the internal temps are quite a bit higher, and probably some of those are very localised. (FWIW, I did a lot of product safety testing before I retired, and that included extended temperature testing to ensure that products & critical components did not exceed safe limits for insulation and to be touched - so I kinda have a "calibrated finger" which knows when something gets near the safe-to-touch temps limits, such as around 60C for metal handles/cases!) What is kinda puzzling is the way that the USB id/response changes after they have begun to "fail" and are then allowed to cool down - at which point they seem to fail completely. To me that means there is one or more of the following defects: - one or more overheated electronic components failing, and it seems to be the RF ends that fail first, followed by the USB interfaces. - soldered joints failing due to thermal stressing/cooling factors, which would be understandable if the joints (presumably most of the components are SMD) were not made correctly in the first place - inadequate manufacturing process test & burn-in times to screen out dodgy units and identify the root causes of the problems [/QUOTE]
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